Munich, July 29 (ANI
- BusinessWireIndia): Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) extends its product portfolio of thyristor/diode modules in solder bond technology with a 50 mm module. These bipolar modules address the growing market for cost-effective solutions even in demanding applications. Depending on the module, market prices are approximately 25 percent lower than comparable pressure contact variants. Solder bond modules are ideal for applications where the high robustness of pressure contact technology is not necessarily a must. Typical applications for the new 50 mm modules are drives, power supplies and welding.
With the release of the new 50 mm modules, Infineon Technologies Bipolar complements the existing product portfolio of bipolar modules. The 50 mm variant covers current ratings from 280 A to 330 A. The 20 mm and 34 mm variants have been in production for more than two years and proven their reliability in the field. All modules have been developed as cost and performance optimized alternative to pressure contact technology. They are packaged in industrial standard housings with an electrically insulated base plate. (ANI